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YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB Clamp Online
Original price was: $14.20.$7.10Current price is: $7.10.
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Description
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Description
iProGadgets Repair Tools YCS-H03 Mini Fixture Mobile Phone Motherboard Chip BGA Clamp Multi-function Glue Removal BGA Soldering Adjustable PCB Clamp
Features:
- Larger size, more clamping space, fully applicable to various types of chips motherboards
- Removal of tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone Android full series IC chip, removal of glue tin Not blocking the knife
- Motherboard cleaning doesn t require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
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Package includes:
1 x FixtureÂ
Additional Information
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